Top 10 foundries in the world, TSMC is far ahead

In January 2021, ChipInsights released the top ten exclusive foundry rankings in 2020!


In 2020, the overall revenue of exclusive foundry will reach 462.5 billion yuan, an increase of 25.78% over 2019. The overall revenue of the top ten exclusive foundries in 2020 increased by 25.60% compared with 2019, but the overall market share decreased by 0.13 percentage points.

The top ten exclusive foundry companies in 2020 have not changed compared with 2019. In 2020, UMC (UMC) will surpass GlobalFoundries by relying on the good performance of 28nm and the operating efficiency of nearly full capacity, and will return to the second place again. seating. This is the biggest change in the exclusive foundry list.

According to the location of the headquarters, among the top ten exclusive foundry companies, there are five in Taiwan, China (TSMC TSMC, UMC UMC, NSMC Powerchip, the world’s advanced VIS, and WIN), with an overall market share of 76.54%. Compared with 73.79% in 2019, an increase of 2.75 percentage points; one in the United States (GlobalFoundries), with a market share of 7.78%, a decrease of 2.35 percentage points from 10.13% in 2019; one in Israel (Tower), with a market share of 1.71% , a decrease of 0.44 percentage points from 2.15% in 2019; a South Korean company (DB HiTEK) has a market share of 1.32%, an increase of 0.11 percentage points from 1.21% in 2019.There are two in mainland China (SMIC, Hua Hong Group), and they occupy the fourth and fifth positions, but the overall market share has declined. The overall market share in 2020 is 8.35%, compared with 8.51% in 2019 A decrease of 0.16 percentage points.

Among the top ten exclusive foundry companies in 2020, except for GF, which saw a slight decline in revenue due to the sale of Singapore’s FAB3E, the other nine companies have increased. The top three increased by more than 30%, the largest is DB HiTEK, with an annual increase of 36.99%; followed by NSMC, with an increase of 35.71%; TSMC ranked third with an increase of 31.40%.

1. TOP10

  1. TSMC

In 2020, TSMC’s advanced process revenue reached a new high. In the fourth quarter, the combined revenue of 5nm (20%) and 7nm (29%) accounted for half (49%), and the revenue of 28nm and below processes accounted for 74%. The annual revenue of 28nm and below processes accounted for 72%.

On May 15, 2020, TSMC announced that it plans to build an advanced wafer fabrication facility in Phoenix, Arizona, USA. The factory will use TSMC’s 5nm process technology, with a planned monthly production capacity of 20,000 wafers. It is planned to start construction in 2021 and mass production in 2024. It is reported that from 2021 to 2029, TSMC will spend about 12 billion US dollars on the plant.

In the third quarter of 2020, TSMC’s FAB18 factory officially started mass production of 5nm, contributing about US$1 billion in revenue in the quarter. At present, the monthly production capacity is about 60,000 pieces, which is being continuously expanded. It is estimated that the monthly production capacity will reach 100,000 pieces in the second half of 2021.

In November 2020, TSMC Nanke’s new 3-nanometer plant was launched. It is expected that trial production will begin in 2021, and mass production will be ready in the second half of 2022. The area of ​​the previously planned base is about 525 mu, and the area of ​​the clean room is more than 240 mu. The production capacity in the mass production stage is estimated to exceed 600,000 12-inch wafers per year. 3nm will increase the transistor density of the chip by 70%, the speed by 10~15%, and the efficiency by 25~30%. Most of the first wave of production capacity will be reserved for major customers Apple, while others are reserved by Qualcomm, Intel, Xilinx, Nvidia, AMD and other manufacturers.

In 2021, TSMC’s capital expenditure will increase to a record high of 22 billion US dollars, mainly for 5nm and 3nm process related plant and equipment investment, and part of it will be invested in advanced packaging technology and 2nm process research and development.

  2. UMC

In February 2020, UMC announced a capital increase of USD 500 million in Leadcore Integration, and plans to increase the monthly production capacity of Leadcore Integration to 25,000 pieces by mid-2021.

 3. GF

In 2020, GF has not achieved impressive results in 22FDX/22FDX+, 12LP+ and silicon photonics processes.

In 2021, GF’s 12-inch wafer fab Fab 8 in Malta, New York will significantly increase the installation of tools and equipment, effectively increasing production capacity, but there is no plan to build a new factory.

Features of GF’s major factories around the world: Germany’s Dresden factory mainly focuses on WiFi, mobile solutions, mobile phone Display and other products; Singapore factory mainly supplies 5G, RF and other chips; New York Malta factory mainly focuses on FinFET process technology and produces WiFi , SoC products, AI, edge and other products.


SMIC’s 28nm, 14nm, 12nm and N+1 technologies have all entered mass production, and the development of 7nm technology has been completed, and it can enter risk mass production in April 2021. The most critical and most difficult 8 major technologies of 5nm and 3nm have also been launched in an orderly manner. As long as the EUV lithography machine arrives, it can enter the comprehensive development stage. (Excerpted from Liang Mengsong’s open letter)

In October 2020, according to the US export control regulations EAR744.21(b), the US BIS issued a letter to some of SMIC’s suppliers, and some US equipment, accessories and raw materials exported to SMIC will be subject to US exports. Further restrictions imposed by the control regulations require prior application for an export license before continuing to supply SMIC. In December 2020, it was included in the list of Chinese military-related enterprises, but the company issued an announcement saying that it has no impact on operations.

SMIC South’s 12-inch 14nm FinFET process production line has a monthly production capacity of 6,000 pieces by the second quarter of 2020.

In 2020, SMIC’s Tianjin base will continue to expand production, and the monthly production capacity will climb steadily. At present, the scale has exceeded 80,000 pieces, an increase of 30% compared with 60,000 pieces in 2019.

On July 16, 2020, SMIC was successfully listed on the Science and Technology Innovation Board, stock code 688981

On July 31, 2020, SMIC and the Beijing Economic and Technological Development Zone Management Committee entered into and signed the “Cooperation Framework Agreement”. SMIC and the Beijing Development Zone Management Committee intend to jointly establish a joint venture in China, which will be engaged in development and operations focusing on the production of 28nm and above integrated circuit projects. The project will be constructed in two phases. The first phase of the project is planned to eventually achieve a monthly production capacity of about 100,000 12-inch wafers. The first phase plans to invest 7.6 billion US dollars (about 53.1 billion yuan), and the registered capital is planned to be 5 billion. USD, of which SMIC is expected to contribute 51%. The second phase of the project will be launched in due course according to customer and market demand.

In the third quarter of 2020, SMIC’s revenue exceeded US$1 billion for the first time in a single quarter.

  5. Hua Hong Group

Hua Hong Group adheres to both advanced technology and mature technology to build the core competitiveness of the group. In 2020, the scale of the manufacturing industry has been expanded and the level of process technology has been improved. Both the 28-nanometer low-power and HKMG high-performance platforms have achieved mass production; the 12-inch CIS image sensor chip process technology has entered the world’s leading camp; 12-inch Bluetooth, NOR type The market share of characteristic process platforms such as flash memory is leading in China; the world’s first 12-inch power device foundry line of Hua Hong No. 7 plant has achieved mass production; the 8-inch platform has become the most comprehensive and most comprehensive domestic process technology in power semiconductors, embedded storage, etc. leading company.

On January 1, 2020, Hua Hong Wuxi Base held the first batch of power device wafer casting ceremony, and signed a contract with Wuxi New Clean Energy. Based on the IC+Power strategy, Hua Hong Wuxi has successively launched process platforms such as Logic, eFlash, BCD, SOI RF and Power, which can meet the needs of most domestic design companies. In 2020, the three major platforms of embedded flash memory, logic RF and low-voltage power devices will continue to be mass-produced and shipped. In the fourth quarter, high-voltage power device IGBT and super-junction products will be delivered and verified. And obtained an order from the domestic NOR Flash company Zhaoyi Innovation. The current monthly production capacity can reach 20,000 pieces, and it will continue to expand production capacity in 2021.

During the “Thirteenth Five-Year Plan” period, Hua Hong Group successively built Hua Hong Factory No. 6 and Hua Hong Factory No. 7, realizing the transition from 8 inches to 12 inches. In 2020, the 12-inch production capacity has exceeded 50%, and the revenue share has exceeded the 8-inch business for the first time.

It is reported that in 2021, Huahong Group will start the construction of Huahong Eighth Factory.

 6. Power semiconductor

On December 9, 2020, POWERCHIP (6770) was listed on Emerging Markets (6770), and the market value on that day soared to NT$172.4 billion. In Taiwan, PSMC has three 12-inch plants with a monthly production capacity of 100,000 pieces, and two 8-inch plants with a monthly production capacity of 140,000 pieces.

In November 2020, MediaTek spent NT$1.62 billion to purchase semiconductor manufacturing equipment from Lam Research, Canon, and TEL, and leased it to NSMC to ensure capacity supply. It is reported that Power Semiconductor will provide MediaTek with a monthly production capacity of 20,000 pieces, which is enough to ensure MediaTek’s supply of low-end chips to domestic mobile phones.

In terms of capacity expansion, NSMC will accelerate the expansion of the 8-inch factory capacity in 2020, and it is estimated that the monthly capacity will increase by 20,000 pieces by the end of 2021; in terms of 12-inch capacity, the construction of the new Tongluo factory will start in the second quarter of 2021.

  7. Tower Semiconductor

On March 1, 2020, Tower Semiconductor officially launched a new brand, replacing TowerJazz Semiconductor with Tower Semiconductor, emphasizing its commitment to providing the highest value analog semiconductor solutions

 8. World advanced

On January 1, 2020, GF’s Fab 3E plant in Singapore, which was acquired by World Advanced (VIS), was officially put into operation, and the total production capacity of World Advanced will increase by 15-20%. The world’s advanced will take advantage of the trend to enter the MEMS foundry business, and continue to invest in the field of new materials such as gallium nitride.

 9. Eastern High-tech

In 2020, the total monthly production capacity of the two 8-inch wafers under DB HiTek has reached 130,000 wafers, an increase of 8% compared with the monthly production capacity of 120,000 wafers in 2018.

The company’s strategic focus is on high value-added specialty processes in analog, power (BCDMOS), CMOS image sensor (CIS), and mixed-signal fields, with a recent focus on developing MEMS, power devices, and RF HRS/SOI CMOS. The company’s high-pressure process has won many orders from small and medium-sized customers in China.

 10. Steady

On July 30, 2020, WIN (WIN) signed an industry-university cooperation plan with the Institute of Optoelectronic Engineering and Optoelectronics Innovation Research Center of National Taiwan University to jointly deploy the next generation of compound semiconductors. It is expected that the research and development results can be applied to next-generation base station communication technologies such as 5G, as well as high-speed drive circuits for data centers, long-distance sensing and transmission of automotive radar (LiDar), 5G and biomedical imaging, etc., to meet the needs of the next generation. The application of integrated high-bandwidth optical communication module is targeted.

 Second, second-line exclusive foundry

 1. X-FAB

On July 5, 2020, X-FAB announced that due to a cyber attack, all the company’s IT systems were immediately stopped and production at six production bases was stopped at the advice of industry-leading security experts. However, with the collaboration of a team of internal and external security experts, all systems were quickly restored, but the company’s third-quarter revenue fell to below $100 million, a 26% decline from the same period in 2019 and a 19% decline from the second quarter of 2020.

 2. Hefei Jinghe

In November 2020, the monthly production capacity of 12-inch wafers in the N1 factory exceeded 30,000 wafers, and the process technology was continuously improved. In terms of production capacity, Jinghe Integration will actively expand production. At present, the N2 factory has entered the preparation period, the clean room is under construction, and equipment procurement is being carried out simultaneously. It is expected to start contributing production capacity in 2021. It is expected that the monthly production capacity will reach 100,000 when the two factories N1+N2 are at full production.

In the first quarter of 2021, the company’s CIS products will enter the mass production stage.

 3. Jita Semiconductor

On June 30, 2020, the Jaita Semiconductor 8-inch special process production line project located in Shanghai Lingang New Area was officially put into production.

On December 28, 2019, the equipment was moved in. Currently, Jita Semiconductor uses many domestic equipment, including North Huachuang, Shanghai Microelectronics, Laipu Technology, and Zhongke Flying Test. On March 30, 2020, the production line was officially launched.

JTA Semiconductor focuses on the R&D and manufacturing of characteristic production processes required for analog circuits and power devices. The chips it produces are widely used in automotive electronics, industrial control, power management, smart terminals, and even high-end application markets such as rail transit and smart grids. It will significantly enhance the core competitiveness and large-scale production capacity of China’s power devices (IGBT), power management, sensors and other chips.

 4. Yuexin Semiconductor

In 2020, the production capacity of the first phase of Yuexin is approaching the 20,000 mark.

The Phase II project of Yuexin was announced in February 2020 to start production expansion, with a total investment of 6.5 billion. It is currently in the stage of equipment commissioning.

 5. Shaoxing SMIC

In January 2020, the 8-inch project of SMIC (Shaoxing) Co., Ltd. was officially mass-produced, and the production capacity climbed rapidly. So far, nearly 50,000 pieces of installed capacity have been completed, and 20,000 pieces of equipment are being installed and debugged.

SMIC Shaoxing has three major process platforms: one is MEMS platform, including MEMS microphone, pressure sensor, ultrasonic sensor, oscillator, accelerometer, gyroscope; the other is MOSFET process platform, including trench MOSFET, split gate MOSFET and Superjunction MOSFET; the third is based on Field Stop IGBT structure.

 6. Haichen Semiconductor

On March 16, 2020, the Wuxi Haichen 8-inch project was successfully filmed; on December 12, 2020, the Haichen semiconductor project was officially put into production. Production capacity will be gradually opened in 2021.

Haichen Semiconductor’s 8-inch wafer simulation production line, with a total investment of 1.4 billion US dollars, has a planned annual production capacity of 1.38 million 8-inch wafers. It mainly produces panel driver ICs (DDI), power management ICs (PMIC), CMOS image sensors ( CIS).

 7. Key Foundry

On March 31, 2020, SK Hynix spent US$435 million to buy the foundry division of MagnaChip Semiconductor and acquired production lines and technologies in an 8-inch foundry.

In August 2020, it was renamed Key Foundry and officially opened on September 1. Lee Tae-jong, the former head of Magna’s foundry division, was hired as CEO. Lee Tae-jung built Magna’s foundry business, building power management IC (Power management) and CMOS image sensor foundry production lines, which is the company’s core business.

The 8-inch wafer foundry is located in Cheongju with a monthly production capacity of about 90,000 wafers.

In the future, we will not rule out cooperation with SK Hynix System IC Company.

Dr. Lee Tae-jong was in charge of product development at Samsung Semiconductor and Chartered Semiconductor, and served as CTO and head of foundry division at MagnaChip Semiconductor for 12 years.

 3. IDM and OEM

  1. Samsung OEM

On February 20, 2020, Samsung announced that its first semiconductor production line V1 based on extreme ultraviolet lithography (EUV) technology has begun mass production. The V1 production line will start delivering the first batch of 7nm and 6nm mobile chips in the first quarter. According to Samsung’s plan, by the end of 2020, the cumulative total investment of the V1 production line will reach 6 billion US dollars, and the total production capacity of 7nm and below process nodes is expected to triple from 2019.

  2. Wuhan Xinxin

Despite the impact of the new crown pneumonia epidemic, Wuhan Xinxin started from March 28 in 2020, and its capacity utilization rate reached 100%, and since April 6, it has continuously hit a record high daily load factor index. At present, the company’s monthly production capacity is approaching the 40,000 mark.

On May 13, 2020, Wuhan Xinxin announced that its 50nm FloatingGate process SPI NOR Flash wide-voltage product series XM25QWxxC will be mass-produced across the board, with product capacities ranging from 16Mb to 256Mb. XM25QWxxC series products further improve the competitiveness in terms of performance and cost.

  4. Conclusion

In the first half of 2020, the global semiconductor industry was prepared by panic due to the new crown epidemic, as well as new forms of remote office and teaching. In the second half of 2020, due to the advance of Huawei’s ban, the increase in the penetration rate of 5G smartphones and the strong demand for related infrastructure construction , with an annual growth rate of 25.6%.

In 2020, due to the severe shortage of 8-inch production capacity, some 8-inch products were forced to switch to 12-inch products, making the tighter 12-inch production capacity even tighter; in 2021, due to the acceleration of Intel’s advanced process outsourcing, Sony, OmniVision, and Samsung high-pixel CIS It will also be outsourced on a large scale, and I am afraid it will further exacerbate the tension of 12-inch production capacity.

In 2021, as a number of new 8-inch foundries in mainland China will continue to increase production, coupled with the continued expansion of 12-inch production in mainland China, perhaps mainland foundry companies will usher in another good year.


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