The industrial chain is getting better, and Xiamen’s third-generation semiconductor key enterprises are summarized

Whether from the perspective of science and technology or economy, the semiconductor industry has irreplaceable strategic significance and belongs to the basic supporting industry of the national economy. In the “Thirteenth Five-Year Plan” National Science and Technology Innovation Plan issued by the State Council, the third-generation semiconductor is listed as one of the country’s major projects for 2030.

In recent years, all parts of the country have accelerated the layout and development of third-generation semiconductors. At present, several key development areas, mainly the Beijing-Tianjin-Hebei, Yangtze River Delta, Pearl River Delta and Fujian Delta, have been initially formed. Among them, Xiamen, located in the hinterland of the Fujian Triangle, has a solid industrial foundation and rapid development, and has become an important pole in China’s third-generation semiconductor industry.

In 2019, Xiamen Science and Technology Bureau launched the “Future Industry Cultivation Project” to preemptively deploy ten future industries, and the third-generation semiconductor is one of them.

In fact, Xiamen has been deploying third-generation semiconductors for many years. As early as 2011, Han Tiancheng was established in Xiamen Torch High-tech Zone. It is the first industrialized 3/4/6-inch SiC epitaxial wafer manufacturer in China. In 2020, it was invested by Huawei Hubble.

At present, Xiamen SiC power power electronics has initially formed an industrial chain covering epitaxy, chips, devices, components and applications, with representative companies such as Sanan Integration, Hantiancheng, Xinguang Runze; and in the field of GaN microwave radio frequency, The preliminary industrialization capacity of upstream, middle and downstream has been formed.


 The industrial chain is getting better, and Xiamen’s third-generation semiconductor key enterprises are summarized

Table: Xiamen’s third-generation semiconductor related support policies

  development Goals

Form a domestic R&D, manufacturing, brand and operation base with great agglomeration and radiation effects, and strive to achieve an output value of 20 billion yuan by 2021.


Location Advantage

Relying on the unique geographical advantage of Taiwan, Xiamen has extensive cooperation and exchanges with the third-generation semiconductor industry in Taiwan. Xiamen has advantages in market, manufacturing, and capital, while Taiwan has advantages in talent, management, and technology. Cross-strait cooperation can form a good complement of industries.

Scientific and educational advantages

Xiamen University has a national integrated circuit industry and education integration innovation platform. The school’s electronics discipline also has a long history and is one of the earliest universities in my country to establish a semiconductor discipline. At the same time, in 2018, the Ministry of Education officially approved the inclusion of Xiamen University Microelectronics College as a preparatory unit for the National Model Microelectronics College.

In terms of third-generation semiconductors, Xiamen University and Sanan Optoelectronics have jointly established a third-generation semiconductor industry-education integration sub-platform to carry out strategic, forward-looking, basic, and comprehensive technological innovations, as well as talent training cooperation.

Operator environment advantages

The front page of “Xinhua Daily Telegraph” once published the article “Xiamen: Building a First-Class Business Environment to Help “Large Investment Promotion”. During the process of the Silan Micro Compound Semiconductor project being settled in Xiamen Haicang, from the signing of the land transfer contract It only took 5 days to get the construction permit.

For a long time, Xiamen has attached great importance to the construction of the business environment. Since 2015, it has been benchmarking against advanced economies such as Singapore, referring to the World Bank evaluation standard system, and striving to create a world-class business environment.

Taking enterprise electricity consumption as an example, since last year, the electricity cost of Xiamen enterprises has continued to decrease. Xiamen is the first country in the country to implement a policy of full funding from the government for the construction of external power lines for small and medium-sized enterprises with a capacity of 1,250 kVA and below, with “zero investment” in the external lines of enterprises. Currently, 28 companies have enjoyed a subsidy of 7 million yuan.

In addition, Xiamen’s power supply quality has always maintained a leading position in China. In 2019, Xiamen’s urban power supply reliability ranked first among 50 major cities in the country. In the first quarter of this year, Xiamen’s power supply reliability rate ranked first in the State Grid Corporation, providing a more solid and reliable basis for Xiamen’s high-level investment promotion and BRICS innovation cooperation. Assure. According to estimates, according to the World Bank’s business environment “Access to Electricity” indicator, Xiamen has jumped to the 9th place in the world.

The business environment is increasingly optimized, domestic and foreign capital favor Xiamen, and a large number of high-quality industrial projects have come one after another, injecting new and powerful vitality into promoting Xiamen’s high-quality development.

LED industry advantages

As one of the most important gathering places and radiating places for the national LED epitaxial chip and LED bulb lamps and other technology industries, Xiamen has inherent advantages in the development of third-generation semiconductors.

GaN is an important epitaxial material in the LED field. Based on their own understanding of materials, LED companies have deployed compound semiconductor materials such as GaN/SiC, which can be said to be close to water. Earlier, Wu Ling, chairman of the National Third Generation Semiconductor Industry Technology Innovation Strategic Alliance, said in an interview with the media that leading LED companies such as Sanan Optoelectronics, Ganzhao Optoelectronics, and Silan Ming Gallium are accelerating their transformation and upgrading to the third generation of semiconductors.

Xiamen develops the third-generation semiconductor industry, on the one hand, it can enrich the connotation and extension of the semiconductor industry, and on the other hand, it can build a future industry with Xiamen characteristics and independent intellectual property rights. Forward-looking thinking and strategic vision will definitely make Xiamen among the third-generation semiconductors in my country. The industry’s first phalanx and vanguard.

key enterprises

The industrial chain is getting better, and Xiamen’s third-generation semiconductor key enterprises are summarized


Sanan Optoelectronics

Global LED chip leader

Domestic compound semiconductor IDM leader

The subsidiary Xiamen Sanan Integration specializes in the R&D and manufacturing of III-V compound semiconductors (GaAs/GaN/SiC) and other materials. At present, three major technology platforms, including microwave radio frequency, power electronics, and optical communication, have been formed. The products are mainly used in lighting, Display microwave radio frequency, laser communication, power devices and other fields.

In 2014, Sanan IC took the lead in building the first 6-inch compound semiconductor civilian production line in Xiamen. In 2016, Xiamen Sanan Huanyu established a joint venture with GCS to focus on compound RF PA foundry. In 2017, the company’s HBT process passed key customer product certification. All process qualification tests have been completed.

At the same time, Sanan Optoelectronics has also established strategic cooperative relations with Huaxin Investment Management (the sole management institution of the large fund) and other four parties, and strongly supports the development of the company’s integrated circuit business focusing on III-V compound semiconductors.

In 2019, Sanan and Midea Group jointly established the third-generation semiconductor joint laboratory, which will be introduced into white goods through the research and development of third-generation semiconductor power devices, and the scientific research forces of both parties will jointly promote the innovative development of third-generation semiconductor power devices.

In 2020, it signed a strategic cooperation framework agreement with King Long Motors in Xiamen to jointly promote the prototype trial production and batch application of SiC power devices in new energy bus motor controllers and auxiliary drive controllers.

San’an Integrated Changsha SiC manufacturing base started production in the second half of the year. Focusing on the explosion of the electric smart vehicle market in 2025, it has laid out its SiC production capacity in advance, and invested in the construction of a thousand-mu manufacturing base in Changsha, Hunan. The first phase of the project has been fully capped in January 2021, and the machines will be commissioned in April. Started production, with an estimated annual output of 400,000 6-inch SiC wafers. The Changsha base vertically integrates the links from substrate materials – epitaxial growth – wafer manufacturing – to packaging and testing, improving cost-effectiveness, shortening product iteration cycles, and accelerating the popularization of wide-bandgap semiconductors in the field of electric smart vehicles.


Han Tiancheng

Domestic SiC epitaxial wafer leader

The first domestic supplier of commercialized 3/4/6-inch SiC epitaxial wafers, invested by Huawei Hubble in 2020. It not only undertook a major national science and technology project (02 special project) and two national 863 projects, but also established cooperation with Zhuzhou CRRC Times Electric Co., Ltd. to provide it with epitaxial wafers for 3300V SiC power devices, which greatly improved The overall performance and work efficiency of the EMU.

In March of this year, Han Tiancheng, together with University of Electronic Science and Technology of China, Chinese Academy of Sciences, Chongqing Witsen, etc., broke through the worldwide problem of SiC material deep trench etching and filling, and successfully developed a SiC superjunction manufacturing process with excellent gap filling ability.


core light moisturizing

Main domestic SiC

Intelligent power module (IPM) mass production enterprise

Specializing in the R&D and manufacturing industrialization of SiC power modules, relying on a number of patents related to power components including circuit design, manufacturing, packaging, etc. that have been applied for, the first batch of professional SiC national laboratories has been established.

Xinguang Runze has cooperated with industry giants and established related module companies in aerospace, photovoltaic, smart grid, rail transit, new energy vehicles, home appliances and other related application fields.


Silan Ming Gallium

The parent company Silan Micro is the domestic scale

One of the largest integrated circuit IDM companies

Jointly invested and established by Hangzhou Silan Microelectronics and Xiamen Semiconductor Investment Group Co., Ltd., it is engaged in the research and development and manufacture of compound semiconductor devices. Its main products include third-generation compound power semiconductor devices, 5G and RF-related modules, and high-end LED chip products.

In December 2020, the project “Silicon-based GaN device and integrated circuit process integration technology research” undertaken by it has passed the comprehensive performance evaluation.

Continuing its development idea in silicon-based devices – production line construction and R&D in parallel, it is expected to accumulate some first-mover advantages for the development of third-generation semiconductors.

In addition, compared with the more difficult SiC substrate devices, the company starts with gallium nitride on silicon, which can integrate the company’s existing technology accumulation of silicon-based devices. The technical difficulty is relatively small, which is conducive to the rapid realization of industrialization.


Huatian Hengxin

Committed to the development and manufacture of SiC devices

Huatian Hengxin was established in 2015 with a registered capital of 510 million yuan, of which China Development Fund Co., Ltd. invested 160 million yuan, holding 31.37% of the shares.

In 2018, Huatian Hengxin signed a cooperation framework agreement with Xiamen Torch Industry Development Fund, and the two parties will cooperate on Huatian Hengxin’s third-generation semiconductor silicon carbide project. The project will further supplement the back-end manufacturing functions of the third-generation semiconductor industry chain in the high-tech zone, and promote the development of related industries such as integrated circuits in the high-tech zone.

According to information from Xiamen Torch Group, the project is committed to the development, manufacturing and sales of third-generation semiconductor silicon carbide devices, with an estimated total investment of 2.5 billion yuan. It is planned to build the first domestic and world-leading 6-inch silicon carbide chip production line.

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