The competition between TSMC and Samsung expands from advanced process to advanced packaging

At Apple’s autumn press conference, Apple’s A14 Bionic processor, which is manufactured by TSMC’s most advanced 5-nanometer process, has been unveiled and is expected to be installed on Apple’s new iPhones and new-generation iPad Air tablets.

And TSMC’s competitor Samsung is not too worried about the development of advanced processes. Recently, it was reported that it has won the OEM order for Qualcomm’s latest flagship mobile processor, the Snapdragon 875, which shows that TSMC and Samsung are in advanced technology. The fierce competition between you and me in the process.

According to reports from South Korean media, the two wafer foundries with the world’s top technologies are currently not only competing in advanced manufacturing processes, but also expanding the battlefield to the scope of advanced packaging, in order to master the future Business.

The report pointed out that TSMC and Samsung are currently the leaders of advanced manufacturing processes in the global wafer foundry industry, but TSMC has always been ahead of Samsung in the development of advanced manufacturing processes in recent years. For example, in the 7-nanometer and 5-nanometer advanced processes, TSMC is the first to commercialize, and the product yield is also high, which makes TSMC always favored by most market customers recently, so it has won a lot of orders. In this regard, Samsung, which is still lagging behind at this stage, obviously has to take some measures to reverse its disadvantage. Therefore, it further extends the foundry process to chip packaging and continues to compete with TSMC.

A few days ago, the South Korean supply chain pointed out that Samsung has deployed 3D chip packaging technology since last month, with the purpose of seeking to compete with TSMC in the field of advanced chip packaging in 2022. It is understood that Samsung’s 3D chip advanced packaging technology is named “eXtended-Cube”, referred to as “X-Cube”, which has been demonstrated in mid-August, in which 7nm process technology will be used to provide customers with related products .

Compared with Samsung’s big move, of course, the current foundry leader TSMC has also developed advanced chip packaging technology. According to TSMC’s previous presentations during the Global Technology Forum and the Open Innovation Platform Ecosystem Forum, TSMC also already has 3D silicon stacking and advanced packaging technology series and services to provide customers with strong and flexible interconnectivity and advanced technology. packaging technology to unleash their innovations.

According to Wei Zhejia, president of TSMC, TSMC found that after developing advanced manufacturing processes, the current 2D semiconductor shrinking does not meet the needs of future heterogeneous integration, which makes the 3D semiconductor shrinking developed by TSMC a solution to meet future system performance, reduce area, integrate different functions, etc. the way.

Therefore, TSMC also decided to integrate advanced 3D packaging technology platforms such as CoWoS, InFO-R, Chip on Wafer, Wafer on Wafer, etc., and will be named “TSMC 3DFabric” in the future. In the future, this platform will continue to provide interface connection solutions. In order to meet the needs of customers to integrate logic chips, high-bandwidth memory and special process chips.

The report further emphasized that TSMC and Samsung are fiercely competing in the field of advanced chip packaging. The reason is that the advanced chip manufacturing process is increasingly limited by the limits of Moore’s Law, and the development of advanced packaging will be the key to the next generation of semiconductors. Therefore, whoever can grasp the key, will also be able to gain the upper hand in the competition.

However, for the competition between TSMC and Samsung in advanced chip packaging technology, the report also said that it may have an impact on the main business of the original semiconductor packaging and testing companies, including the packaging and testing companies ASE and Sipin. As for the future development trend, it remains to be further observed.

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