Supplying SMIC, this semiconductor material project is expected to be completed by the end of 2022

According to the development of Beijing news, the Jiangfeng sputtering target and key components industrialization project of sputtering equipment located in the Jinqiao Science and Technology Industrial Base of Beijing Economic and Technological Development Zone has just started recently. According to the project leader, the excavation of the industrial plant is currently underway, and the next step is to start piling operations. The project is expected to be completed by the end of 2022.

In the future, the industrialization project of Jiangfeng sputtering targets and key components of sputtering equipment will build a production line of high-purity metal targets and parts for the semiconductor and flat-panel Display industries, with an annual production capacity of 55,000 pieces, and ultimately achieve ultra-high purity Large-scale production and sales of Al, Ti, Ta, Cu, W, Mo and other targets and key equipment components.

Sputtering targets are important basic raw materials for integrated circuit assembly. Beijing Business Daily pointed out that after the project is completed by the end of 2022, the sputtering target and key components of the sputtering equipment in the factory will enter the industrial production stage, and will be supplied to SMIC in the future for semiconductor, Display panel and other assembly.

According to the person in charge, at present, the basic components it provides have basically reached the domestic first-class level, and the target accuracy can be up to 5 nanometers.

It is reported that the industrialization project of Jiangfeng sputtering targets and key components of sputtering equipment is the first production plant of Jiangfeng Group in Beijing. Prior to this, Jiangfeng Group has built factories in Yiyang, Hunan, Huizhou, Guangdong and other places, supplying customers including SMIC and BOE.

According to the data, Jiangfeng Electronics is mainly engaged in the R&D and production of ultra-high-purity metal materials and sputtering targets for VLSI manufacturing. Ended the history of relying on imports for products, successfully obtained the certification of a world-class chip manufacturer, and applied it in batches in the field of global advanced 5nm FinFET (FF+) technology ultra-large-scale integrated circuit manufacturing, becoming a Chinese force in the field of Electronic materials to successfully participate in the international market competition .

 

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