ST’s latest STM32H7A3, STM32H7B3 and STM32H7B0 Value Line microcontrollers (MCUs) feature 280MHz ArmCortex-M7 processing performance, high memory capacity and energy-saving technologies for designing next-generation smart product devices.
New MCUs keep power consumption low, entry-level products are housed in cost-effective 64-pin QFP packages, with improved integration and real-time performance to handle advanced functions such as feature-rich user interfaces, natural language interactions, RF networking state networks and artificial intelligence (AI).
The new product enhances support for embedded graphics, for example, up to 1.4MB of RAM can support up to 24-bit color advanced user interface with HVGA resolution, eliminating the need for external SRAM, thereby reducing development costs.
Higher power efficiency and enhanced DSP capabilities allow speech and audio processing applications to efficiently handle audio front-end and output generation tasks.
For applications requiring more advanced communication connectivity technologies, the CPU performance and flash memory capacity of the new MCUs can handle evolving RF communication protocols. The 4.57mm x 4.37mm Wafer Level Chip Scale Package (WLCSP) option simplifies the integration of microcontrollers in wireless modules.
With the adoption of AI artificial intelligence in embedded devices, the new STM32H7 MCUs have the power efficiency required for machine learning applications and the performance required to support next-generation neural networks.
For data security-conscious IoT applications, the new products integrate state-of-the-art network security protections, including secure boot/root of trust and hardware cryptographic/hash algorithm accelerators. The new on-the-fly decryption (OTFDEC) function extends protection to external serial memory, enabling real-time decryption of encrypted content, protecting software code in external memory.
The new MCU is equipped with an embedded security installation service, where users can order standard products from anywhere in the world, and then hand over encrypted firmware to partner manufacturers for installation without leakage at any stage. After product hardware verification and secure firmware installation, the root of trust mechanism will support all secure firmware services, including firmware field updates.
Dual power domains allow designers to manage power flexibly, and voltage regulation techniques enable run and stop modes for optimal energy efficiency. On-chip SMPS power supplies help reduce bill of materials (BOM) costs and power the MCU’s internal circuitry and external components. In stop mode, the SMPS power supply is powered on, all contents in the RAM are retained, and the chip operating current is 32µA. Standby current is only 4µA.
The high-performance products of the new STM32H7 have rich digital communication interfaces and up to two eight-wire SPI external memory interfaces, as well as an RGB interface for connecting to an XGA Display, a Chrom-ART Accelerator that replaces the CPU to process 2D graphics, and is optimized for non-rectangular displays. Chrom-GRC supported, as well as hardware JPEG codec.
The STM32 development ecosystem includes the STM32H7B3I-EVAL dedicated evaluation board, the STM32H7B3I-DK Discovery Kit and the NUCLEO-H7A3ZI-Q Nucleo-144 development board. The STM32CubeH7 software package has several applications and demo routines and associated source code, including a graphics solution based on TouchGFX™ technology. Users can also take advantage of motor control development kits, AI application development tools and the STM32Trust cybersecurity ecosystem.
Samples of the new STM32H7 products, STM32H7A3 and STM32H7B3, are available now, and most models will be mass-produced in January 2020, and the full range of products will be available for sale by June 2020.