E dismantling: dismantling Redmi K30 5G, revealing secrets other than configuration

In the first year of 5G in 19, although many brands released 5G mobile phones, the overall price was high, until Redmi K30 5G broke into the market at the lowest price of 1999. I must be as curious as Xiao e, will K30 “cut corners” in order to control costs?

E dismantling: dismantling Redmi K30 5G, revealing secrets other than configuration

Due to panic buying, Xiaoe bought 8GB+128GB. Therefore, the following dismantling analysis data are based on the purchased equipment.

E disassembly

First, take out the cartridge with the silicone ring. The back cover and the inner support are fixed by glue. After the heat gun heats the gap between the back cover and the inner support, slowly pry open the back cover.

E dismantling: dismantling Redmi K30 5G, revealing secrets other than configuration

The main board cover and the speaker are fixed by screws, and a large area of ​​graphite sheet covers the main board and battery position, which is good for heat dissipation. An antenna board is fixed on the front of the speaker.

E dismantling: dismantling Redmi K30 5G, revealing secrets other than configuration

The NFC coil, rear camera cover and antenna are all fixed by glue and removed in turn.

E dismantling: dismantling Redmi K30 5G, revealing secrets other than configuration

Then remove the main board, front and rear cameras, sub-boards and other components.

It can be seen that the internal support corresponds to the location of the motherboard processor & memory, not only coated with heat dissipation grease, but also in contact with the heat dissipation copper pipe. There is also copper foil on the camera soft board to protect and dissipate heat. Secondly, the earphone hole and USB interface on the sub-board are covered with a silicone sleeve for waterproofing.

E dismantling: dismantling Redmi K30 5G, revealing secrets other than configuration

The battery is fixed on the inner support by two easy-pull glues, and the battery is removed.

E dismantling: dismantling Redmi K30 5G, revealing secrets other than configuration

Remove the button soft board, earpiece, sensor soft board, etc. The side fingerprint recognition sensor soft board and the button soft board are equipped with a silicone pad for protection, and the sensor soft board is also covered with a silicone cover.

E dismantling: dismantling Redmi K30 5G, revealing secrets other than configuration

The screen and the inner support are fixed by glue, and the heating table is used to heat the screen, and the screen and the inner support can be separated to complete the complete disassembly.

E dismantling: dismantling Redmi K30 5G, revealing secrets other than configuration

Redmi K30 5G uses a three-stage design, the overall design is more rigorous, not inferior. The waterproof design of the whole machine is that the SIM card holder, the USB interface and the earphone hole are covered with silicone rings for waterproofing. In terms of heat dissipation, the heat is dissipated by means of graphite sheet + heat dissipation silicone grease + liquid-cooled copper pipe. In addition, large-area graphite sheets are also attached to the motherboard and battery for heat dissipation.

E dismantling: dismantling Redmi K30 5G, revealing secrets other than configuration

E analysis:

Through dismantling, eWiseTech organized a total of 1364 components of Redmi K30 5G (8GB+128GB). The estimated price of the overall component is about $210.92, of which the main control IC accounts for 51%. But what are the main control chips on the motherboard?

Front of the motherboard:

1: Qualcomm-QPM5677-RF power amplifier chip

2: Qualcomm-QPM6585-RF power amplifier chip

3: Qualcomm-SDR865-RF transceiver chip

4: Qualcomm-WCN3998-WiFi/BT chip

5: Qualcomm-WCD9385-audio codec chip

6: Samsung-KM8V8001JM-8GB memory + 128GB flash memory

7: NXP-SN100T-NFC control chip

8: Qualcomm-SM7250-Qualcomm Snapdragon 765G processor chip

9: Qualcomm-PM7250B-power management chip

The back of the motherboard:

1: Qualcomm-PM7150L-power management chip

2: Qualcomm-PM7250-power management chip

3: RF front-end module chip

4: Qualcomm-QDM2310-RF front-end module chip

5: RF front-end module chip

6: QORVO-QM77040-RF front-end module chip

7: QORVO-QM77032-RF front-end module chip

It can be seen that the IC part is mainly from the United States, so if the cost of the device is classified by country, the cost is still the highest in the United States, accounting for 32.9%, and 57 components are provided. But in the component Tap5, South Korea is among the best.

Of course, there are more unexpected “secrets” in the BOM of Redmi K30, waiting for you to discover in the eWisetech search database. Not only that in the eWisetech database, but also……

The Links:   G190SF01-V0 https://www.slw-ele.com/esm4016.html“> ESM4016